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    Copprint LF-360 Nano Copper Ink for high conductivity screen printing on PET/PC substrates. Technology: Screen printing Appearance: Copper paste Filler Type: Copper Substrate: PET/PC Key Product Benefits High conductivity Excellent adhesion Excellent printability with screen printing High metal loading High flexibility Drying: Ceramic lamps/hot air/thermal plate/oven Sintering: R2R or Heat press Application: Conductive Nano Copper […]

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    LF-360 – paste for low temp sintering on PET/PC substrate

    LF-360 – paste for low temp sintering on PET/PC substrate

    LF-360 – paste for low temp sintering on PET/PC substrate

    Copprint LF-360 Nano Copper Ink for high conductivity screen printing on PET/PC substrates.
    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: PET/PC

    Key Product Benefits

    • High conductivity
    • Excellent adhesion
    • Excellent printability with screen printing
    • High metal loading
    • High flexibility

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: R2R or Heat press
    Application: Conductive Nano Copper Ink
    Common Applications: Printing Heaters, sensors, antennas, membrane switches and more.

    Copprint LF-371 Nano Copper Ink for high conductivity additive thick screen-printing on FR4, Glass, Alumina. Technology: Screen printing Appearance: Copper paste Filler Type: Copper Substrate: FR4, Glass, Alumina Key Product Benefits Ultra high conductivity Excellent adhesion Very-low fabrication cost, efficient (no material waste) Hybrid ink – Micro and nano Cu particles. Excellent printability with screen […]

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    LF-371 – paste for thick printing on FR4, Glass and Alumina substrate

    LF-371 – paste for thick printing on FR4, Glass and Alumina substrate

    LF-371 – paste for thick printing on FR4, Glass and Alumina substrate

    Copprint LF-371 Nano Copper Ink for high conductivity additive thick screen-printing on FR4, Glass, Alumina.

    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: FR4, Glass, Alumina

    Key Product Benefits

    • Ultra high conductivity
    • Excellent adhesion
    • Very-low fabrication cost, efficient (no material waste)
    • Hybrid ink – Micro and nano Cu particles.
    • Excellent printability with screen printing
    • Rapid self-sintering, really simple fabrication in air environment
    • Non toxic, green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press, hot plate conveyor
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Application: FPCB and PCB

    Copprint LF-370 Nano Copper Ink for high conductivity additive screen printing on R4, Glass, Alumina. Technology: Screen printing Appearance: Copper paste Filler Type: Copper Substrate: FR4, Glass, Alumina Key Product Benefits Ultra high conductivity Excellent adhesion Very-low fabrication cost, efficient (no material waste) Hybrid ink – Micro and nano Cu particles. Excellent printability with screen […]

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    LF-370 – paste for FR4, Glass and Alumina substrate

    LF-370 – paste for FR4, Glass and Alumina substrate

    LF-370 – paste for FR4, Glass and Alumina substrate

    Copprint LF-370 Nano Copper Ink for high conductivity additive screen printing on R4, Glass, Alumina.

    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: FR4, Glass, Alumina

    Key Product Benefits

    • Ultra high conductivity
    • Excellent adhesion
    • Very-low fabrication cost, efficient (no material waste)
    • Hybrid ink – Micro and nano Cu particles.
    • Excellent printability with screen printing
    • Rapid self-sintering, really simple fabrication in air environment
    • Non toxic, green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press, hot plate conveyor
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Application: FPCB and PCB

    Copprint LF-390 Nano Copper Ink for high conductivity additive screen printing on PI substrates. Technology: Screen printing Appearance: Copper paste Filler Type: Copper Substrate: PI Key Product Benefits High conductivity Very-low fabrication cost Nano copper particle size for pattern precision Excellent printability and adhesion on PI substrates Rapid self-sintering, really simple fabrication in air environment […]

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    LF-390 – paste for PI substrate

    LF-390 – paste for PI substrate

    LF-390 – paste for PI substrate

    Copprint LF-390 Nano Copper Ink for high conductivity additive screen printing on PI substrates.
    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: PI

    Key Product Benefits

    • High conductivity
    • Very-low fabrication cost
    • Nano copper particle size for pattern precision
    • Excellent printability and adhesion on PI substrates
    • Rapid self-sintering, really simple fabrication in air environment
    • Green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Applications: Flexible PCBs on PI

    Copprint LF-350 Nano Copper Ink for high conductivity screen printing on PET substrates. Technology: Screen printing Appearance: Copper paste Filler Type: Copper Substrate: PET Key Product Benefits High conductivity Very-low fabrication cost Nano copper particle size for pattern precision Excellent printability and adhesion on PET substrates Rapid self-sintering, really simple fabrication in air environment Green […]

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    LF-350 – paste for PET substrate

    LF-350 – paste for PET substrate

    LF-350 – paste for PET substrate

    Copprint LF-350 Nano Copper Ink for high conductivity screen printing on PET substrates.
    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: PET

    Key Product Benefits

    • High conductivity
    • Very-low fabrication cost
    • Nano copper particle size for pattern precision
    • Excellent printability and adhesion on PET substrates
    • Rapid self-sintering, really simple fabrication in air environment
    • Green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Applications: Printing Heaters, antennas, membrane switches and more.

    Copprint LF-300 Nano Copper Ink for high conductivity additive screen printing on paper. Technology: Screen printing Appearance: Copper paste Filler Type: Copper Substrate: Paper Key Product Benefits High conductivity Very-low fabrication cost, efficient (no material waste) Nano copper particle size for thin layer patterns Excellent printability and adhesion on paper substrates Rapid self-sintering, really simple […]

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    LF-300 – paste for paper substrate

    LF-300 – paste for paper substrate

    LF-300 – paste for paper substrate

    Copprint LF-300 Nano Copper Ink for high conductivity additive screen printing on paper.
    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: Paper

    Key Product Benefits

    • High conductivity
    • Very-low fabrication cost, efficient (no material waste)
    • Nano copper particle size for thin layer patterns
    • Excellent printability and adhesion on paper substrates
    • Rapid self-sintering, really simple fabrication in air environment
    • Non toxic, green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press, hot plate conveyor
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Application: printing, UHF, NFC,HF RFID antennas on a paper substrate