Copprint LF-371 Nano Copper Ink for high conductivity additive thick screen-printing on FR4, Glass, Alumina.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: FR4, Glass, Alumina
Key Product Benefits
- Ultra high conductivity
- Excellent adhesion
- Very-low fabrication cost, efficient (no material waste)
- Hybrid ink – Micro and nano Cu particles.
- Excellent printability with screen printing
- Rapid self-sintering, really simple fabrication in air environment
- Non toxic, green circuits, environmentally friendly
Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: FPCB and PCB