Copprint LF-301 Nano Copper Ink for high conductivity additive screen printing on paper.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: Paper
Key Product Benefits
- High conductivity
- Very-low fabrication cost, efficient (no material waste)
- Nano copper particle size for thin layer patterns
- Excellent printability and adhesion on paper substrates
- Rapid self-sintering, really simple fabrication in air environment
- Non toxic, green circuits, environmentally friendly
Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: printing, UHF, NFC,HF RFID antennas on a paper substrate