The Latest from Copprint

NOVA from Voltera is a powerful tool supporting the Copprint inks.
See how easy it is to work with low cost, sustainable conductive copper ink for designing and fabricating compostable antennas.

Copprint is honored to be selected as a 2022 Edison Awards finalist.
We are proud to be recognized by this prestigious award for the significant positive environmental impact of Copprint Nano Copper inks. We are making sustainable manufacturing of electronic circuits and compostable green electronics a reality, for printed RFID antennas and circuits everywhere.

https://www.linkedin.com/posts/shochet_copprint-edisonawards-printedelectronics-activity-6897214609426649088-7vn1

Additive Manufacturing of Electronics requires good soldering and is enabled with Copprint’s conductive copper inks, as demonstrated by the formation of an IMC layer (Inter Metallic Compound). This layer is formed during reflow between the solder alloy and printed conductive copper paste and is the index of good soldering (see explanation here ).

Full process details:

1. Print copper traces on FR4 substrate with Copprint copper pastes.
2. Soldering process – can be done even one week after sintering.
   1. Print off-the-shelf solder paste. (The most recommended paste is Henkel Loctite LF-318).
   2. Component placement.
   3. Standard reflow process.

Die shear tests after the process indicated >3Kgf for 1206 SMD resistor soldered on Copprint’s LF360 with SAC305 Loctite LF-318.

We are honored to have TATSUTA Electric Wire and Cable Co., Ltd. as a new investor at Copprint, joining Henkel and HP.
https://lnkd.in/du2YjGS

See on LinkedIn