TYPICAL PROPERTIES OF COPPRINT NANO COPPER PASTE (UNCURED)
Particle Size, μm <0.15
Solid Content, after 30 minutes @150ºC, 85%
Density, 3 g/ml
Viscosity @ r.t., DVEHA Brookfield spindle 14, mPa∙s (cps) 4000-6000
Thixotropic Index (1.5/15 s-1) 1.4-1.6
Coverage area @5μm dry film thickness, 17 m²/kg
Shelf Life, @20°C, 180 days
Flash Point – See SDS
Drying and Sintering:
Copprint LF-390 may be dried employing dry hot air, (near) infrared or ceramic lamps. Sintering temperatures and times depend on PI substrate and equipment.
Drying cycle: 180 sec @70°C (Hot air/Thermal Plate)
Sintering cycle: 15-120 sec @180-200°C (Hot press)
*Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.
CURED NANO COPPER Physical Properties
Adhesion: tape test 3M Scotch 234 (Passed)
Cross cut test ISO 2409-2007 4-5b
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.005
DIRECTIONS FOR NANO COPPER INK USE
Nano Copper Paste Activation:
Copprint LF-390 is supplied as a single-component formulation ready for use.
SCREEN PROPERTIES
Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 200 Shore
EQUIPMENT MAINTENANCE & CLEAN-UP
Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol.
STORAGE
Store sealed container @4°C in a dry location.
Optimal Storage Temperature: 4°C. (Storage above 30°C can adversely affect product properties.)
Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions
SAFETY INFORMATION
For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
Safety information
For safe handling of Copprint Nano Ink consult the
Safety Data Sheet (SDS).