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Interested in learning how Nano Copper Inks can help you print additive copper flexible electronics?

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CONDUCTIVE NANO COPPER INKS

Print Ready, Nano Copper Conductive Inks

Copprint’s Nano Copper Inks enable additive printing of flexible electronics.

Our oxidation free, rapid self-sintering in air environment Nano Copper inks, make it possible to print high conductivity, low-cost printed electronics, using standard printing equipment on a range of substrates.

Copprint inks are fully compostable, minimizing the ecological footprint for sustainable printed green crcuits.

Explore Nano Copper Inks

INNOVATION

We eliminate the copper oxidation-conductivity tradeoff.

Oxidation Free, Rapid Self-Sintering in Air Environment

Our patented chemical sintering agent activates a chemical reaction in Nano Copper particles that prevents oxidation.

Copprint Nano Copper inks enable rapid few seconds self sintering at 180-300°C, in air environments using standard printing equipment including screen, inkjet, Flexo and Gravure.

AFTER PRINTING, BEFORE SINTERING.
80 Nanometer Copper Particles.
500 nm
Additive Screen Printing of Conductive Patterns

Copprint Nano Copper Inks enable high precision additive screen printing of conductive patterns on a range of substrates including paper, fabrics, PET, PI and HJT PV cells.

Copprint makes it possible to gain the benefits of easy, high throughput, economical, fabrication of single and double sided flexible electronics.

Our inks are based on proprietary nano copper fabrication processes that yield substantial ink cost reductions relative to alternative nano-Copper particle vendors.

HOMOGENOUS SELF-SINTERING
Up to 50% bulk CU conductivity after 2 second sintering.
500 nm

Nano Copper
Inks by
Substrate

LF-300 – paste for paper substrate

Copprint LF-300 Nano Copper Ink for high conductivity additive screen printing on paper.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: Paper

Key Product Benefits

  • High conductivity
  • Very-low fabrication cost, efficient (no material waste)
  • Nano copper particle size for thin layer patterns
  • Excellent printability and adhesion on paper substrates
  • Rapid self-sintering, really simple fabrication in air environment
  • Non toxic, green circuits, environmentally friendly

Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: printing, UHF, NFC,HF RFID antennas on a paper substrate


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TYPICAL PROPERTIES: UNCURED NANO COPPER PASTE

Particle Size, μm <0.15
Solid Content, after 30 minutes @150ºC, 85%
Density, 3 g/ml
Viscosity @ r.t. , DVEHA Brookfiled spindle 14, mPa∙s (cps) 4000-6000
Thixotropic Index (1.5/15 s-1) 1.4-1.6
Coverage area @5μm dry film thickness, 17 m²/kg
Shelf Life, @4°C, 180 days
Flash Point – See Safety Data Sheet (SDS)

Drying and Sintering:
Copprint LF-300 may be dried employing dry hot air, (near) infrared or ceramic lamps.
Drying cycle: 15 sec @150°C (Ceramic lamps)
Sintering cycle: 10 sec @250°C (Hot plates) and few seconds in a hot plate conveyor
*Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.

TYPICAL PROPERTIES: CURED NANO COPPER PASTE

Adhesion: tape test 3M Scotch 234 (Passed)
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.003

DIRECTIONS FOR NANO COPPER INK USE

Copprint LF-300 is supplied as a single-component formulation ready for use.

SCREEN PROPERTIES

Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 200 Shore

EQUIPMENT MAINTENANCE & CLEAN-UP

Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol. See Application Notes.

STORAGE AND HANDLING

Store sealed container under 4°C in a dry location.
(Storage above 30°C can adversely affect product properties.)

Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions

Safety information
For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
Technical Data Sheet
For technical data please see the Technical Data Sheet (TDS)

LF-350 – paste for PET substrate

Copprint LF-350 Nano Copper Ink for high conductivity additive screen printing on PET substrates.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: PET

Key Product Benefits

  • High conductivity
  • Very-low fabrication cost
  • Nano copper particle size for pattern precision
  • Excellent printability and adhesion on PET substrates
  • Rapid self-sintering, really simple fabrication in air environment
  • Green circuits, environmentally friendly

Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press
Application: Conductive Nano Copper Ink for Additive Printing
Common Applications: Printing Heaters, antennas, membrane switches and more.


Open-Close
TYPICAL PROPERTIES OF COPPRINT NANO COPPER PASTE (UNCURED)

Particle Size, μm <0.15
Solid Content, after 30 minutes @150ºC, 85%
Density, 3 g/ml
Viscosity @ r.t., DVEHA Brookfield spindle 14, mPa∙s (cps) 4000-6000
Thixotropic Index (1.5/15 s-1) 1.4-1.6
Coverage area @5μm dry film thickness, 17 m²/kg
Shelf Life, @4°C, 180 days
Flash Point – See SDS

Drying and Sintering:
Copprint LF-350 may be dried employing dry hot air, (near) infrared or ceramic lamps. Sintering temperatures and times depend on PET substrate and equipment.
Drying cycle: 180 sec @70°C (Hot air/Thermal Plate)
Sintering cycle: 15-120 sec @180-200°C (Hot press)
*Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.

CURED NANO COPPER Physical Properties

Adhesion: tape test 3M Scotch 234 (Passed)
Cross cut test ISO 2409-2007 4-5b
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.005

DIRECTIONS FOR NANO COPPER INK USE

Nano Copper Paste Activation:
Copprint LF-350 is supplied as a single-component formulation ready for use.

SCREEN PROPERTIES

Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 200 Shore

EQUIPMENT MAINTENANCE & CLEAN-UP

Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol.

STORAGE

Store sealed container @4°C in a dry location.
(Storage above 30°C can adversely affect product properties.)

Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions

Safety information
For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
Technical Data Sheet
For technical data please see the Technical Data Sheet (TDS)

LF-390 – paste for PI substrate

Copprint LF-390 Nano Copper Ink for high conductivity additive screen printing on PI substrates.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: PI

Key Product Benefits

  • High conductivity
  • Very-low fabrication cost
  • Nano copper particle size for pattern precision
  • Excellent printability and adhesion on PI substrates
  • Rapid self-sintering, really simple fabrication in air environment
  • Green circuits, environmentally friendly

Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press
Application: Conductive Nano Copper Ink for Additive Printing
Common Applications: Flexible PCBs on PI


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TYPICAL PROPERTIES OF COPPRINT NANO COPPER PASTE (UNCURED)

Particle Size, μm <0.15
Solid Content, after 30 minutes @150ºC, 85%
Density, 3 g/ml
Viscosity @ r.t., DVEHA Brookfield spindle 14, mPa∙s (cps) 4000-6000
Thixotropic Index (1.5/15 s-1) 1.4-1.6
Coverage area @5μm dry film thickness, 17 m²/kg
Shelf Life, @20°C, 180 days
Flash Point – See SDS

Drying and Sintering:
Copprint LF-390 may be dried employing dry hot air, (near) infrared or ceramic lamps. Sintering temperatures and times depend on PI substrate and equipment.
Drying cycle: 180 sec @70°C (Hot air/Thermal Plate)
Sintering cycle: 15-120 sec @180-200°C (Hot press)
*Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.

CURED NANO COPPER Physical Properties

Adhesion: tape test 3M Scotch 234 (Passed)
Cross cut test ISO 2409-2007 4-5b
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.005

DIRECTIONS FOR NANO COPPER INK USE

Nano Copper Paste Activation:
Copprint LF-390 is supplied as a single-component formulation ready for use.

SCREEN PROPERTIES

Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 200 Shore

EQUIPMENT MAINTENANCE & CLEAN-UP

Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol.

STORAGE

Store sealed container @4°C in a dry location.
Optimal Storage Temperature: 4°C. (Storage above 30°C can adversely affect product properties.)

Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions

SAFETY INFORMATION

For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).

Safety information
For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
Copprint Order Form (Beta)
Phone*
Purchases of any products listed in this quotation are subject to Copprint's end user agreement, a copy of which is available here: www.copprint.com/EUA (the "EUA"). By submitting any purchase order for the Products you agree to the terms of the EUA.
All pricing is EXW.

ADDITIVE COPPER APPLICATIONS

Nano Copper Inks that outperform silver.

RFID

RFID ANTENAS

Copprint Nano Ink for RFIDs antenas printed on paper including HF, UHF, NFC. Copprint lowers costs, increases yield and offers a sustainable solution relative to silver or etched antennas.

LF-300 – paste for paper substrate

FLEXIBLE ELECTRONICS

Copprint Nano Ink for PCBs on PET, PI, PC. Economical, fast, high yield additive printing for heaters and defoggers, sensors, flexible connectors, single and double sided PCBs, touch panel bezel contacts, conductive fabrics, Conductive patterns, batteries and many more.

LF-350 – paste for PET substrate
LF-390 – paste for Polyimide Substrate

FE
PV

Photovoltaic (PV) cells

opprint Nano Ink for Heterojunction Photovoltaic (PV) cell metallization. High conductivity with up to 70% cost savings relative to top silver pastes, transforming the PV market by dramatically reducing costs of HJT PVs to that of PERC cells.

LF-380 – HJT PV (under development)

HOW TO COPPRINT

The Nano Copper Additive Advantage

Copprint Nano Copper Inks are enabling additive fabrication for printed conductive patterns from prototyping to reel-to-reel maufacturing.

Suitable for a range of substrates, additive copper takes flexible electronics to a new level.

Print any pattern simple to complex with unmatched conductivity. Minimal waste, lowest cost, high yield.

Nano Copper Screen Printing
Etched Metals (Aluminum / Copper) to Additive Printed Copper
  • Substrate freedom to print on materials that cannot withstand etching, such as paper, fabric, among others.
  • When subtractive etching is uneconomical, including conductive elements that result in 70% and higher material waste during production.
  • Short runs
  • Throughput sensitive manufacturing and rapid assembly
  • Green circuits, environmentally friendly.
Silver Inks to Nano Copper Inks
 
  • High conductivity at 3-5X cost savings
  • Throughput sensitive manufacturing and rapid assembly
  • Substrate freedom
  • Green circuits, environmentally friendly.

Print, Dry, Sinter

Short Run Prototyping
Really Simple Screen Printing Fabrication

Screen printing
Screen printing
Drying oven/conveyor 10-60 seconds
Drying oven/conveyor 10-60 seconds
Standard hot press / hot plate conveyor in seconds
Standard hot press / hot plate conveyor in seconds
Industrial Scale Antenna Printing Solution (APS)
Industrial Scale Antenna Printing Solution (APS)
Muhlbauer Automated Antenna Printing Solution for industrial fabrication.