We are Copprint, a Nano Copper Ink Company.
Interested in learning how Nano Copper Inks can help you print additive copper flexible electronics?
Copprint’s Nano Copper Inks enable additive printing of flexible electronics.
Our oxidation free, rapid self-sintering in air environment Nano Copper inks, make it possible to print high conductivity, low-cost printed electronics, using standard printing equipment on a range of substrates.
Copprint inks are fully compostable, minimizing the ecological footprint for sustainable printed green crcuits.
Explore Nano Copper InksOur patented chemical sintering agent activates a chemical reaction in Nano Copper particles that prevents oxidation.
Copprint Nano Copper inks enable rapid few seconds self sintering at 180-300°C, in air environments using standard printing equipment including screen, inkjet, Flexo and Gravure.
Copprint Nano Copper Inks enable high precision additive screen printing of conductive patterns on a range of substrates including paper, fabrics, PET, PI and HJT PV cells.
Copprint makes it possible to gain the benefits of easy, high throughput, economical, fabrication of single and double sided flexible electronics.
Our inks are based on proprietary nano copper fabrication processes that yield substantial ink cost reductions relative to alternative nano-Copper particle vendors.
Copprint LF-300 Nano Copper Ink for high conductivity additive screen printing on paper.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: Paper
Key Product Benefits
Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: printing, UHF, NFC,HF RFID antennas on a paper substrate
Particle Size, μm <0.15
Solid Content, after 30 minutes @150ºC, 85%
Density, 3 g/ml
Viscosity @ r.t. , DVEHA Brookfiled spindle 14, mPa∙s (cps) 4000-6000
Thixotropic Index (1.5/15 s-1) 1.4-1.6
Coverage area @5μm dry film thickness, 17 m²/kg
Shelf Life, @<-10°C, 180 days
Flash Point – See Safety Data Sheet (SDS)
Drying and Sintering:
Copprint LF-300 may be dried employing dry hot air, (near) infrared or ceramic lamps.
Drying cycle: 15 sec @150°C (Ceramic lamps)
Sintering cycle: 10 sec @250°C (Hot plates) and few seconds in a hot plate conveyor
*Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.
Adhesion: tape test 3M Scotch 234 (Passed)
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.003
Copprint LF-300 is supplied as a single-component formulation ready for use.
Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 200 Shore
Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol. See Application Notes.
Store sealed container under -10°C in a dry location.
(Storage above 30°C can adver-10sely affect product properties.)
Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions
Copprint LF-350 Nano Copper Ink for high conductivity screen printing on PET substrates.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: PET
Key Product Benefits
Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press
Application: Conductive Nano Copper Ink for Additive Printing
Common Applications: Printing Heaters, antennas, membrane switches and more.
Particle Size, μm <0.15
Solid Content, after 30 minutes @150ºC, 85%
Density, 3 g/ml
Viscosity @ r.t., DVEHA Brookfield spindle 14, mPa∙s (cps) 4000-6000
Thixotropic Index (1.5/15 s-1) 1.4-1.6
Coverage area @5μm dry film thickness, 17 m²/kg
Shelf Life, @<-10°C, 180 days
Flash Point – See SDS
Drying and Sintering:
Copprint LF-350 may be dried employing dry hot air, (near) infrared or ceramic lamps. Sintering temperatures and times depend on PET substrate and equipment.
Drying cycle: 180 sec @70°C (Hot air/Thermal Plate)
Sintering cycle: 15-120 sec @180-200°C (Hot press)
*Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.
Adhesion: tape test 3M Scotch 234 (Passed)
Cross cut test ISO 2409-2007 4-5b
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.004
Nano Copper Paste Activation:
Copprint LF-350 is supplied as a single-component formulation ready for use.
Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 200 Shore
Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol.
Store sealed container under -10°C in a dry location.
(Storage above 30°C can adversely affect product properties.)
Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions
Copprint LF-390 Nano Copper Ink for high conductivity additive screen printing on PI substrates.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: PI
Key Product Benefits
Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press
Application: Conductive Nano Copper Ink for Additive Printing
Common Applications: Flexible PCBs on PI
Average particle Size, µm D50 < 1.0, D90 < 7.0
Solids Content, after 10 minutes @ 150ºC, % 89±1
Density, g/ml 4.1
Viscosity @ 250C , DVEHA Brookfield spindle 14,
100rpm, mPa∙s (cps) 15,000-20,000
Theoretical coverage @ 14 µm dry film thickness 10.5 m²/kg
Shelf Life @ -10°C, days 180
Flash Point – See SDS
Drying and Sintering:
Drying cycle – 120sec @100°C (Hot air, Reflow oven)
Sintering cycle – 10 sec @300°C (R2R laminator)
Conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer drying equipment, oven loading and actual oven temperatures.
Adhesion: tape test 3M Scotch 234 (Passed)
Cross cut test ISO 2409-2007 4b
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.0025
Nano Copper Paste Activation:
Copprint LF-390 is supplied as a single-component formulation ready for use.
Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 100 to 300
Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol.
Store product in the tightly closed container in a dry location below -100C. Open the container carefully. Storage information may be indicated on the product container labeling.
Optimal Storage: below -10°C. Storage above -10°C can adversely affect product properties.
Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions
For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
Copprint LF-370 Nano Copper Ink for high conductivity additive screen printing on R4, Glass, Alumina.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: FR4, Glass, Alumina
Key Product Benefits
Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: FPCB and PCB
Average particle Size, µm D50 < 0.15, D90 < 5.0
Solids Content, after 30 minutes @ 150ºC, % 85-90
Density, g/ml 3.7
Viscosity @ 250C , DVEHA Brookfield spindle 14,
100rpm, mPa∙s (cps) 6000-8000
Theoretical coverage @ 8 µm dry film thickness, 12 m²/kg
Shelf Life @ -10°C, days 180
Flash Point – See SDS
Flash oint – See Safety Data Sheet (SDS)
Drying and Sintering:
Copprint LF-370 may be dried employing dry hot air, (near) infrared or ceramic lamps.
Drying cycle: 15 sec @150°C (Ceramic lamps)
Sintering cycle: 5 sec @300°C (R2R laminator) or 5-30 sec @ 280-320°C (Heat press)
*Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.
Adhesion: tape test 3M Scotch 234 (Passed)
Cross cut test ISO 2409-2007 5b
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.0025
Copprint LF-370 is supplied as a single-component formulation ready for use.
Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 200 Shore
Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol. See Application Notes.
Store sealed container under -10°C in a dry location.
(Storage above 30°C can adver-10sely affect product properties.)
Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions
Copprint LF-371 Nano Copper Ink for high conductivity additive thick screen-printing on FR4, Glass, Alumina.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: FR4, Glass, Alumina
Key Product Benefits
Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: FPCB and PCB
Average particle Size, µm D50 < 1.0, D90 < 7.0
Solids Content, after 10 minutes @ 150ºC, % 90±1
Density, g/ml 4.15
Viscosity @ 250C , DVEHA Brookfield spindle 14,
100rpm, mPa∙s (cps) 25,000-35,000
Theoretical coverage @ 11 µm dry film thickness, 10.5 m²/kg
Shelf Life @ -10°C, days 180
Flash Point – See SDS
Drying and Sintering:
Copprint LF-371 may be dried employing dry hot air, (near) infrared or ceramic lamps.
Drying cycle: 120sec @100°C (Hot air, Reflow oven)
Sintering cycle: 5 sec @300°C (R2R laminator) or 5-30 sec @ 280-320°C (Heat press)
*Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.
Adhesion: tape test 3M Scotch 234 (Passed)
Cross cut test ISO 2409-2007 5b
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.0025
Copprint LF-371 is supplied as a single-component formulation ready for use.
Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 100 to 200
Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol. See Application Notes.
Store sealed container under -10°C in a dry location.
(Storage above -10°C can adversely affect product properties.)
Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions
Copprint LF-360 Nano Copper Ink for high conductivity screen printing on PET/PC substrates.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: PET/PC
Key Product Benefits
Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: R2R or Heat press
Application: Conductive Nano Copper Ink
Common Applications: Printing Heaters, sensors, antennas, membrane switches and more.
Particle Size, μm D50 < 1.0, D90 < 7.0
Solid Content, after 30 minutes @150ºC, 90%
Density, 4 g/ml
Viscosity @ r.t., DVEHA Brookfield spindle 14, mPa∙s (cps) 12000-17000
Coverage area @5μm dry film thickness, 11.4 m²/kg
Shelf Life, @<-10°C, 180 days
Pot life @ 25°C, Hours 72
Drying and Sintering:
Drying cycle
120sec @90ºC (Hot air, Reflow oven)
Sintering cycle
R2R option: 12 sec @170°C (laminator)
S2S option: 120 sec @140-160°C (Hot Pressing)
Relaxation cycle
PET: 120 sec @ 140C (Hot air, Reflow oven)
PC: 120 sec @ 110C (Hot air, Reflow oven)
Conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer drying equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical
Properties
Adhesion: (tape test 3M Scotch 234) pass
Cross cut test ISO 2409-2007 3-4 b
Electrical Properties: Sheet resistivity
S2S (Hot press), ohm/□/25 µm <0.006
R2R (Contactless Laminator), ohm/□/25 µm <0.009
Copprint LF-360 is supplied as a single-component formulation ready for use.
Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 300
The equipment can be cleaned with Dowanol DB followed by water and repeated if necessary.
Store sealed container under -10°C in a dry location.
(Long storage above -10°C can adversely affect product properties.)
Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions
Copprint Nano Ink for RFIDs antenas printed on paper including HF, UHF, NFC. Copprint lowers costs, increases yield and offers a sustainable solution relative to silver or etched antennas.
Copprint Nano Ink for PCBs on PET, PI, PC. Economical, fast, high yield additive printing for heaters and defoggers, sensors, flexible connectors, single and double sided PCBs, touch panel bezel contacts, conductive fabrics, Conductive patterns, batteries and many more.
LF-350 – paste for PET substrate
LF-370 – paste for FR4 substrate
LF-390 – paste for Polyimide Substrate
Copprint Nano Ink for Heterojunction Photovoltaic (PV) cell metallization. High conductivity with up to 70% cost savings relative to top silver pastes, transforming the PV market by dramatically reducing costs of HJT PVs to that of PERC cells.
Copprint Nano Copper Inks are enabling additive fabrication for printed conductive patterns from prototyping to reel-to-reel maufacturing.
Suitable for a range of substrates, additive copper takes flexible electronics to a new level.
Print any pattern simple to complex with unmatched conductivity. Minimal waste, lowest cost, high yield.
Nano Copper Screen PrintingShort Run Prototyping
Really Simple Screen Printing Fabrication
