We are Copprint, a Nano Copper Ink Company.

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Interested in learning how Nano Copper Inks can help you print additive copper flexible electronics?

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    CONDUCTIVE NANO COPPER INKS

    Print Ready, Nano Copper Conductive Inks

    Copprint’s Nano Copper Inks enable additive printing of flexible electronics.

    Our oxidation free, rapid self-sintering in air environment Nano Copper inks, make it possible to print high conductivity, low-cost printed electronics, using standard printing equipment on a range of substrates.

    Copprint inks are fully compostable, minimizing the ecological footprint for sustainable printed green crcuits.

    Explore Nano Copper Inks

    INNOVATION

    We eliminate the copper oxidation-conductivity tradeoff.

    Oxidation Free, Rapid Self-Sintering in Air Environment

    Our patented chemical sintering agent activates a chemical reaction in Nano Copper particles that prevents oxidation.

    Copprint Nano Copper inks enable rapid few seconds self sintering at 180-300°C, in air environments using standard printing equipment including screen, inkjet, Flexo and Gravure.

    AFTER PRINTING, BEFORE SINTERING.
    80 Nanometer Copper Particles.
    500 nm
    Additive Screen Printing of Conductive Patterns

    Copprint Nano Copper Inks enable high precision additive screen printing of conductive patterns on a range of substrates including paper, fabrics, PET, PI and HJT PV cells.

    Copprint makes it possible to gain the benefits of easy, high throughput, economical, fabrication of single and double sided flexible electronics.

    Our inks are based on proprietary nano copper fabrication processes that yield substantial ink cost reductions relative to alternative nano-Copper particle vendors.

    HOMOGENOUS SELF-SINTERING
    Up to 50% bulk CU conductivity after 2 second sintering.
    500 nm

    LF-300 – paste for paper substrate

    Copprint LF-300 Nano Copper Ink for high conductivity additive screen printing on paper.
    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: Paper

    Key Product Benefits

    • High conductivity
    • Very-low fabrication cost, efficient (no material waste)
    • Nano copper particle size for thin layer patterns
    • Excellent printability and adhesion on paper substrates
    • Rapid self-sintering, really simple fabrication in air environment
    • Non toxic, green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press, hot plate conveyor
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Application: printing, UHF, NFC,HF RFID antennas on a paper substrate


    Open-Close
    TYPICAL PROPERTIES: UNCURED NANO COPPER PASTE

    Particle Size, μm <0.15
    Solid Content, after 30 minutes @150ºC, 85%
    Density, 3 g/ml
    Viscosity @ r.t. , DVEHA Brookfiled spindle 14, mPa∙s (cps) 4000-6000
    Thixotropic Index (1.5/15 s-1) 1.4-1.6
    Coverage area @5μm dry film thickness, 17 m²/kg
    Shelf Life, @<-10°C, 180 days
    Flash Point – See Safety Data Sheet (SDS)

    Drying and Sintering:
    Copprint LF-300 may be dried employing dry hot air, (near) infrared or ceramic lamps.
    Drying cycle: 15 sec @150°C (Ceramic lamps)
    Sintering cycle: 10 sec @250°C (Hot plates) and few seconds in a hot plate conveyor
    *Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.

    TYPICAL PROPERTIES: CURED NANO COPPER PASTE

    Adhesion: tape test 3M Scotch 234 (Passed)
    Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.003

    DIRECTIONS FOR NANO COPPER INK USE

    Copprint LF-300 is supplied as a single-component formulation ready for use.

    SCREEN PROPERTIES

    Emulsion, Solvent resistant emulsion: 10 to 40 μm
    Squeegee Shore Hardness: 70 to 90 Shore
    Screen Type: Polyester screen, mesh 90 to 200 Shore

    EQUIPMENT MAINTENANCE & CLEAN-UP

    Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol. See Application Notes.

    STORAGE AND HANDLING

    Store sealed container under -10°C in a dry location.
    (Storage above 30°C can adver-10sely affect product properties.)

    Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions

     

    Safety information
    For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
    Technical Data Sheet
    For technical data please see the Technical Data Sheet (TDS)

    LF-350 – paste for PET substrate

    Copprint LF-350 Nano Copper Ink for high conductivity additive screen printing on PET substrates.
    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: PET

    Key Product Benefits

    • High conductivity
    • Very-low fabrication cost
    • Nano copper particle size for pattern precision
    • Excellent printability and adhesion on PET substrates
    • Rapid self-sintering, really simple fabrication in air environment
    • Green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Applications: Printing Heaters, antennas, membrane switches and more.


    Open-Close
    TYPICAL PROPERTIES OF COPPRINT NANO COPPER PASTE (UNCURED)

    Particle Size, μm <0.15
    Solid Content, after 30 minutes @150ºC, 85%
    Density, 3 g/ml
    Viscosity @ r.t., DVEHA Brookfield spindle 14, mPa∙s (cps) 4000-6000
    Thixotropic Index (1.5/15 s-1) 1.4-1.6
    Coverage area @5μm dry film thickness, 17 m²/kg
    Shelf Life, @<-10°C, 180 days
    Flash Point – See SDS

    Drying and Sintering:
    Copprint LF-350 may be dried employing dry hot air, (near) infrared or ceramic lamps. Sintering temperatures and times depend on PET substrate and equipment.
    Drying cycle: 180 sec @70°C (Hot air/Thermal Plate)
    Sintering cycle: 15-120 sec @180-200°C (Hot press)
    *Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.

    CURED NANO COPPER Physical Properties

    Adhesion: tape test 3M Scotch 234 (Passed)
    Cross cut test ISO 2409-2007 4-5b
    Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.004

    DIRECTIONS FOR NANO COPPER INK USE

    Nano Copper Paste Activation:
    Copprint LF-350 is supplied as a single-component formulation ready for use.

    SCREEN PROPERTIES

    Emulsion, Solvent resistant emulsion: 10 to 40 μm
    Squeegee Shore Hardness: 70 to 90 Shore
    Screen Type: Polyester screen, mesh 90 to 200 Shore

    EQUIPMENT MAINTENANCE & CLEAN-UP

    Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol.

    STORAGE

    Store sealed container under -10°C in a dry location.
    (Storage above 30°C can adversely affect product properties.)

    Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions

    Safety information
    For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
    Technical Data Sheet
    For technical data please see the Technical Data Sheet (TDS)

    LF-390 – paste for PI substrate

    Copprint LF-390 Nano Copper Ink for high conductivity additive screen printing on PI substrates.
    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: PI

    Key Product Benefits

    • High conductivity
    • Very-low fabrication cost
    • Nano copper particle size for pattern precision
    • Excellent printability and adhesion on PI substrates
    • Rapid self-sintering, really simple fabrication in air environment
    • Green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Applications: Flexible PCBs on PI


    Open-Close
    TYPICAL PROPERTIES OF COPPRINT NANO COPPER PASTE (UNCURED)

    Average particle Size, µm D50 < 1.0, D90 < 7.0
    Solids Content, after 10 minutes @ 150ºC, % 89±1
    Density, g/ml 4.1
    Viscosity @ 250C , DVEHA Brookfield spindle 14,
    100rpm, mPa∙s (cps) 15,000-20,000

    Theoretical coverage @ 14 µm dry film thickness 10.5 m²/kg
    Shelf Life @ -10°C, days 180
    Flash Point – See SDS

    Drying and Sintering:
    Drying cycle – 120sec @1000C (Hot air, Reflow oven)
    Sintering cycle – 10 sec @300°C (R2R laminator)
    Conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer drying equipment, oven loading and actual oven temperatures.

    CURED NANO COPPER Physical Properties

    Adhesion: tape test 3M Scotch 234 (Passed)
    Cross cut test ISO 2409-2007 4b
    Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.0025

    DIRECTIONS FOR NANO COPPER INK USE

    Nano Copper Paste Activation:
    Copprint LF-390 is supplied as a single-component formulation ready for use.

    SCREEN PROPERTIES

    Emulsion, Solvent resistant emulsion: 10 to 40 μm
    Squeegee Shore Hardness: 70 to 90 Shore
    Screen Type: Polyester screen, mesh 100 to 300

    EQUIPMENT MAINTENANCE & CLEAN-UP

    Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol.

    STORAGE

    Store product in the tightly closed container in a dry location below -100C. Open the container carefully. Storage information may be indicated on the product container labeling.

    Optimal Storage: below -10°C. Storage above -10°C can adversely affect product properties.

    Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions

    SAFETY INFORMATION

    For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).

    Safety information
    For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
    Technical Data Sheet
    For technical data please see the Technical Data Sheet (TDS)

    LF-370 – paste for FR4, Glass and Alumina substrate

    Copprint LF-370 Nano Copper Ink for high conductivity additive screen printing on R4, Glass, Alumina.

    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: R4, Glass, Alumina

    Key Product Benefits

    • Ultra high conductivity
    • Excellent adhesion
    • Very-low fabrication cost, efficient (no material waste)
    • Hybrid ink – Micro and nano Cu particles.
    • Excellent printability with screen printing
    • Rapid self-sintering, really simple fabrication in air environment
    • Non toxic, green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press, hot plate conveyor
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Application: FPCB and PCB


    Open-Close
    TYPICAL PROPERTIES: UNCURED NANO COPPER PASTE

    Average particle Size, µm D50 < 0.15, D90 < 5.0
    Solids Content, after 30 minutes @ 150ºC, % 85-90
    Density, g/ml 3.7
    Viscosity @ 250C , DVEHA Brookfield spindle 14,
    100rpm, mPa∙s (cps) 6000-8000

    Theoretical coverage @ 8 µm dry film thickness, 12 m²/kg
    Shelf Life @ -10°C, days 180
    Flash Point – See SDS

    Flash oint – See Safety Data Sheet (SDS)

    Drying and Sintering:
    Copprint LF-370 may be dried employing dry hot air, (near) infrared or ceramic lamps.
    Drying cycle: 15 sec @150°C (Ceramic lamps)
    Sintering cycle: 5 sec @300°C (R2R laminator) or 5-30 sec @ 280-320°C (Heat press)
    *Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.

    TYPICAL PROPERTIES: CURED NANO COPPER PASTE

    Adhesion: tape test 3M Scotch 234 (Passed)

    Cross cut test ISO 2409-2007 5b

    Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.0025

    DIRECTIONS FOR NANO COPPER INK USE

    Copprint LF-370 is supplied as a single-component formulation ready for use.

    SCREEN PROPERTIES

    Emulsion, Solvent resistant emulsion: 10 to 40 μm
    Squeegee Shore Hardness: 70 to 90 Shore
    Screen Type: Polyester screen, mesh 90 to 200 Shore

    EQUIPMENT MAINTENANCE & CLEAN-UP

    Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol. See Application Notes.

    STORAGE AND HANDLING

    Store sealed container under -10°C in a dry location.
    (Storage above 30°C can adver-10sely affect product properties.)

    Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions

    Safety information
    For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
    Technical Data Sheet
    For technical data please see the Technical Data Sheet (TDS)

    LF-371 – paste for thick printing on FR4, Glass and Alumina substrate

    Copprint LF-371 Nano Copper Ink for high conductivity additive thick screen-printing on FR4, Glass, Alumina.

    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: R4, Glass, Alumina

    Key Product Benefits

    • Ultra high conductivity
    • Excellent adhesion
    • Very-low fabrication cost, efficient (no material waste)
    • Hybrid ink – Micro and nano Cu particles.
    • Excellent printability with screen printing
    • Rapid self-sintering, really simple fabrication in air environment
    • Non toxic, green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press, hot plate conveyor
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Application: FPCB and PCB


    Open-Close
    TYPICAL PROPERTIES: UNCURED NANO COPPER PASTE

    Average particle Size, µm D50 < 1.0, D90 < 7.0
    Solids Content, after 10 minutes @ 150ºC, % 90±1
    Density, g/ml 4.15
    Viscosity @ 250C , DVEHA Brookfield spindle 14,
    100rpm, mPa∙s (cps) 25,000-35,000

    Theoretical coverage @ 11 µm dry film thickness, 10.5 m²/kg
    Shelf Life @ -10°C, days 180
    Flash Point – See SDS

    Drying and Sintering:
    Copprint LF-370 may be dried employing dry hot air, (near) infrared or ceramic lamps.
    Drying cycle: 120sec @1000C (Hot air, Reflow oven)
    Sintering cycle: 5 sec @300°C (R2R laminator) or 5-30 sec @ 280-320°C (Heat press)
    *Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.

    TYPICAL PROPERTIES: CURED NANO COPPER PASTE

    Adhesion: tape test 3M Scotch 234 (Passed)

    Cross cut test ISO 2409-2007 5b

    Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.0025

    DIRECTIONS FOR NANO COPPER INK USE

    Copprint LF-371 is supplied as a single-component formulation ready for use.

    SCREEN PROPERTIES

    Emulsion, Solvent resistant emulsion: 10 to 40 μm
    Squeegee Shore Hardness: 70 to 90 Shore
    Screen Type: Polyester screen, mesh 100 to 200

    EQUIPMENT MAINTENANCE & CLEAN-UP

    Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol. See Application Notes.

    STORAGE AND HANDLING

    Store sealed container under -10°C in a dry location.
    (Storage above -10°C can adversely affect product properties.)

    Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions

    Safety information
    For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
    Technical Data Sheet
    For technical data please see the Technical Data Sheet (TDS)

    Copprint Order Form (Beta)
    Phone*
    Purchases of any products listed in this quotation are subject to Copprint's end user agreement, a copy of which is available here: www.copprint.com/EUA (the "EUA"). By submitting any purchase order for the Products you agree to the terms of the EUA.
    All pricing is EXW.

    ADDITIVE COPPER APPLICATIONS

    Nano Copper Inks that outperform silver.

    RFID

    RFID ANTENAS

    Copprint Nano Ink for RFIDs antenas printed on paper including HF, UHF, NFC. Copprint lowers costs, increases yield and offers a sustainable solution relative to silver or etched antennas.

    LF-300 – paste for paper substrate

    FLEXIBLE ELECTRONICS

    Copprint Nano Ink for PCBs on PET, PI, PC. Economical, fast, high yield additive printing for heaters and defoggers, sensors, flexible connectors, single and double sided PCBs, touch panel bezel contacts, conductive fabrics, Conductive patterns, batteries and many more.

    LF-350 – paste for PET substrate

    LF-370 – paste for FR4 substrate
    LF-390 – paste for Polyimide Substrate

    FE
    PV

    Photovoltaic (PV) cells

    Copprint Nano Ink for Heterojunction Photovoltaic (PV) cell metallization. High conductivity with up to 70% cost savings relative to top silver pastes, transforming the PV market by dramatically reducing costs of HJT PVs to that of PERC cells.

    LF-380 – HJT PV (under development)

    HOW TO COPPRINT

    The Nano Copper Additive Advantage

    Copprint Nano Copper Inks are enabling additive fabrication for printed conductive patterns from prototyping to reel-to-reel maufacturing.

    Suitable for a range of substrates, additive copper takes flexible electronics to a new level.

    Print any pattern simple to complex with unmatched conductivity. Minimal waste, lowest cost, high yield.

    Nano Copper Screen Printing
    Etched Metals (Aluminum / Copper) to Additive Printed Copper
    • Substrate freedom to print on materials that cannot withstand etching, such as paper, fabric, among others.
    • When subtractive etching is uneconomical, including conductive elements that result in 70% and higher material waste during production.
    • Short runs
    • Throughput sensitive manufacturing and rapid assembly
    • Green circuits, environmentally friendly.
    Silver Inks to Nano Copper Inks
     
    • High conductivity at 3-5X cost savings
    • Throughput sensitive manufacturing and rapid assembly
    • Substrate freedom
    • Green circuits, environmentally friendly.

    Print, Dry, Sinter

    Short Run Prototyping
    Really Simple Screen Printing Fabrication

    Screen printing
    Screen printing
    Drying oven/conveyor 10-60 seconds
    Drying oven/conveyor 10-60 seconds
    Standard hot press / hot plate conveyor in seconds
    Standard hot press / hot plate conveyor in seconds
    Industrial Scale Antenna Printing Solution (APS)
    Industrial Scale Antenna Printing Solution (APS)
    Muhlbauer Automated Antenna Printing Solution for industrial fabrication.