TYPICAL PROPERTIES OF COPPRINT NANO COPPER PASTE (UNCURED)
Particle Size, μm D50 < 1.0, D90 < 7.0
Solid Content, after 30 minutes @150ºC, 90%
Density, 4 g/ml
Viscosity @ r.t., DVEHA Brookfield spindle 14, mPa∙s (cps) 12000-17000
Coverage area @5μm dry film thickness, 11.4 m²/kg
Shelf Life, @<-10°C, 180 days
Pot life @ 25°C, Hours 72
Drying and Sintering:
120sec @90ºC (Hot air, Reflow oven)
R2R option: 12 sec @170°C (laminator)
S2S option: 120 sec @140-160°C (Hot Pressing)
PET: 120 sec @ 140C (Hot air, Reflow oven)
PC: 120 sec @ 110C (Hot air, Reflow oven)
Conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer drying equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical
Adhesion: (tape test 3M Scotch 234) pass
Cross cut test ISO 2409-2007 3-4 b
Electrical Properties: Sheet resistivity
S2S (Hot press), ohm/□/25 µm <0.006
R2R (Contactless Laminator), ohm/□/25 µm <0.009
DIRECTIONS FOR NANO COPPER INK USE
Copprint LF-360 is supplied as a single-component formulation ready for use.
Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 300
EQUIPMENT MAINTENANCE & CLEAN-UP
The equipment can be cleaned with Dowanol DB followed by water and repeated if necessary.
Store sealed container under -10°C in a dry location.
(Long storage above -10°C can adversely affect product properties.)
Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions
For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS).
Technical Data Sheet
For technical data please see the Technical Data Sheet (TDS)