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Interested in learning how Nano Copper Inks can help you print additive copper flexible electronics?

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    LF-371 – paste for thick printing on FR4, Glass and Alumina substrate

    Copprint LF-371 Nano Copper Ink for high conductivity additive thick screen-printing on FR4, Glass, Alumina.

    Technology: Screen printing
    Appearance: Copper paste
    Filler Type: Copper
    Substrate: R4, Glass, Alumina

    Key Product Benefits

    • Ultra high conductivity
    • Excellent adhesion
    • Very-low fabrication cost, efficient (no material waste)
    • Hybrid ink – Micro and nano Cu particles.
    • Excellent printability with screen printing
    • Rapid self-sintering, really simple fabrication in air environment
    • Non toxic, green circuits, environmentally friendly

    Drying: Ceramic lamps/hot air/thermal plate/oven
    Sintering: Hot press, hot plate conveyor
    Application: Conductive Nano Copper Ink for Additive Printing
    Common Application: FPCB and PCB